Process of printed circuit board assembly

The PCB assembly process involves various steps that enable the placement and attachment of electronic components onto a printed circuit board (PCB). The process includes the following steps:

Parts Procurement: The first step in the process of PCB assembly is sourcing and procuring the necessary components and materials required to assemble the board.

Stenciling: After component procurement, a solder paste stencil is placed on top of the PCB, and a solder paste is applied to the stencil openings using a squeegee.

Pick and Place: After applying the solder paste, the pick-and-place machine is used to accurately place the components on the board's surface. The machine rapidly picks up the components and places them onto the specified locations on the board, according to Gerber files and the Bill of Materials (BOM).

Reflow Soldering: Once all the components have been placed onto the board, the board is then put through a reflow oven process, where heat is applied to the solder paste to melt and reflow it into the shape of the components, creating a strong mechanical and electrical bond between the board and the components.

Inspection: After soldering, the assembled PCB is then inspected to ensure that all the components have been placed in the correct locations, there are no soldering defects, the board passes Functional Testing (FCT), and meets all the required quality standards.

Rework and Finishing: In case of errors found during inspection, rework is done to fix them. After rework, the board is cleaned, and any final finishing steps such as labelling, coding, marking, and packaging are done.

Overall, from sourcing and procurement of components to rework and finishing, the process of PCB assembly requires precision, accuracy, and high-quality control. When done correctly, PCB assembly creates functional and reliable electronic devices that meet or exceed the performance and safety specifications of the end product.