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What are the different types of electronic assembly processes?

2024-09-26

Electronic Assembly is the process of placing electronic components on a printed circuit board (PCB) to form a functional electronic system. This process involves several steps, including soldering, wiring, and testing. The electronic assembly industry has seen significant growth over the years due to the increasing demand for electronic devices in various industries such as medical, aerospace, automotive, and telecommunications. Below are several questions and answers related to electronic assembly processes.

What are the different types of electronic assembly processes?

There are several electronic assembly processes, including surface mount technology (SMT), through-hole technology (THT), ball grid array (BGA), and chip-on-board (COB) assembly. SMT is the most popular assembly process used in the industry due to its efficiency, high speed, and accuracy. THT, on the other hand, is commonly used for electronic devices that require robust mechanical connections. BGA is a type of SMT that uses an array of small spherical balls instead of traditional pins to connect electronic components to a board. COB assembly is used for electronic devices that require miniaturization, such as smartwatches or hearing aids.

What are the benefits of electronic assembly?

Electronic assembly provides several benefits such as reduced manufacturing time, increased productivity, improved accuracy and efficiency, and reduced labor costs.

What are the challenges of electronic assembly?

Electronic assembly can be challenging due to the complex nature of electronic components and the need for precise placement and soldering. The increasing miniaturization of electronic devices can also pose a challenge to electronic assembly. In summary, electronic assembly plays a critical role in producing electronic devices, and as the demand for electronic devices continues to grow, the electronic assembly industry is set to continue expanding.

Shenzhen Hi Tech Co., Ltd. is a leading provider of electronic assembly services in China. With over 10 years of experience in the electronic assembly industry, we have built a solid reputation for delivering high-quality products and excellent customer service. Contact us at Dan.s@rxpcba.com for all your electronic assembly needs.

Research Papers

1. H. Jin, M. Zhang, Y. Zhou, X. Zhang, and L. Wang. (2018). Design and Implementation of the Electronic Assembly Quality Information Management System. IEEE Access, 6, 21772-21784.

2. Z. Yu, X. Liu, and S. Li. (2017). Integration of Lean Six Sigma and TRIZ for Process Improvement in Electronic Assembly. International Journal of Quality Engineering and Technology, 7(2), 155-168.

3. V. D. Tournois, L. M. G. Meuwissen, A. J. M. Pemen, R. Dekena, and R. J. G. van Leuken. (2020). Advanced Power Electronics Packaging: System Integration and Manufacturing Based on High-Quality Electronic Assembly. IEEE Transactions on Power Electronics, 35(10), 10843-10857.

4. K. S. Chen, Y. K. Chiu, and C. C. Li. (2019). Integration of Modular Building Blocks in Electronic Assembly. Journal of Mechanical Engineering Research and Developments, 42(4), 697-704.

5. R. V. Luebbers, J. S. Bandorick, S. P. Singh, S. K. Khan, and R. Seshadri. (2018). Robotic Assembly of Electronic Components on Three-Dimensional Structures. Journal of Manufacturing Science and Engineering, 140(5), 050903.

6. L. Li, Y. Xu, L. Wu, and H. Li. (2016). Design of New Electronic Assembly Technology Based on PLCA. Journal of Computational and Theoretical Nanoscience, 13(12), 10396-10402.

7. S. Z. Zhou, W. P. Chen, and X. G. Zhang. (2017). Online Monitoring and Intelligent Diagnosis for Electronic Assembly Based on Deep Learning. Journal of Electronic Measurement and Instrumentation, 31(11), 1529-1536.

8. J. Feng, Z. Wang, X. Liang, and G. Ji. (2019). Design and Implementation of a Low-Cost Solution for Robotic Assembly in Electronic Industry. IEEE International Conference on Information and Automation, 386-391.

9. Y. Wang, S. Y. Zhang, and W. Gong. (2020). Assessment of Electronic Assembly Quality Based on Analytic Hierarchy Process and Grey Relational Analysis. IEEE Conference on Robotics, Automation and Mechatronics, 193-198.

10. S. S. Xie and K. W. Lee. (2018). A Comparative Analysis of Electronic Assembly Systems Based on Fuzzy Analytic Hierarchy Process. Journal of Intelligent Manufacturing, 29(6), 1157-1165.



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